New SMT Equipment: through glass via (Page 1 of 6)

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

SMT Assembly Middle Size Hot Air Lead Free Reflow Oven

New Equipment | Reflow

Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Full Hot Air Lead-Free Reflow Oven with PLC A800

Full Hot Air Lead-Free Reflow Oven with PLC A800

New Equipment | Reflow

Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Permabond - Rapid-Curing, Structural Acrylic Adhesives

Permabond - Rapid-Curing, Structural Acrylic Adhesives

New Equipment | Materials

Permabond structural acrylic adhesives are suitable for bonding a wide variety of materials. The rapid, room-temperature cure coupled with high strength and durability make these adhesives ideal for demanding applications where speed and ease of appl

Permabond Engineering Adhesives

14 pins butterfly package housing

14 pins butterfly package housing

New Equipment | Assembly Services

14 PINS BUTTERFLY GLASS PACKAGE Low temperature glass feed-through package is suitable for Butterfly Type Module, Pump Laser Diode Module, Photodiode, Optic Telecommunication etc. glass-to-metal sealed package   14 PINS BUTTERFLY CERAMIC PAC

ZHENGZHOU KIEGOO PHOTONICS TECHNOLOGY CO., LTD.

T2000 SD

New Equipment |  

100% ESD material, thicknesses ranging from 3mm-12mm. (with cycles through a wave solder machine reaching 250,000 cycles)-(color-black)-fine woven glass with a special high temperature resin system

MSC Morkstar Corporation

LPKF ProConduct® - Through-hole Conductivity System

LPKF ProConduct® - Through-hole Conductivity System

New Equipment | Through-Hole

In-House PCB Through-Hole Plating without Chemicals The LPKF ProConduct® introduces revolutionary technology to produce plated through-holes, which does not require a plating tank or potentially hazardous processing chemicals. This compact system is

LPKF Laser & Electronics

Measure Foundry

Measure Foundry

New Equipment |  

Measure Foundry is a rapid application development package that provides a system solution for all types of measurement instruments. Measure Foundry fulfills the promise of being able to build complex test and measurement applications easily without

Data Translation, Inc.

Single/double PCBs

Single/double PCBs

New Equipment |  

Partial List of Services • single/double Multi-layer (up to 30) • SMT & Through-hole • Quick-turn Prototypes • Production Quantities with Scheduled Deliveries • Blind Via • Buried Via • 0.5mm pitch • IPC Standards • 24-hour multi-layer quick-tur

Shenzhen Fullygold circuit Technology Co.,ltd

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