Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
New Equipment | Industrial Automation
new and original！！BENTLY NEVADA 125840-02 new and original！！BENTLY NEVADA 125840-02 Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Tel : +86 592 5165503 Skype: onlywnn_1 Wechat : mooreplc
New Equipment | Industrial Automation
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New Equipment | Industrial Automation
new and original！！ICS TRIPLEX T9432 new and original！！ICS TRIPLEX T9432 Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Tel : +86 592 5165503 Skype: onlywnn_1 Wechat : mooreplc
New Equipment | Industrial Automation
new and original！！ABB SD831 3BSC610064R1 new and original！！ABB SD831 3BSC610064R1 Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Tel : +86 592 5165503 Skype: onlywnn_1 Wechat : mooreplc
New Equipment | Industrial Automation
Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Tel : +86 592 5165503 Skype: onlywnn_1 Wechat : mooreplc website : www.salesplc.com PRODUCT PARAMETERS 1.Shipping will be made via DHL(Worldw
New Equipment | Industrial Automation
Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Tel : +86 592 5165503 Skype: onlywnn_1 Wechat : mooreplc website : www.salesplc.com PRODUCT PARAMETERS 1.Shipping will be made via DHL(Worldw
Premo-Flex™ FFC and etched polyimide jumpers, available in a variety of pitches, cable lengths and thicknesses, plus high-temperature ratings up to +105°C, deliver durable, ultra flexible, competitively priced solutions for PCB connections in virtual
New Equipment | Solder Paste Stencils
The LPKF ZelFlex Z4P is a unique patented pneumatic four-sided stretching frame for quick and uniform clamping of SMT metal stencils.
Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis
