New Equipment | Education/Training
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure
New Equipment | Education/Training
Designing Flex and Rigid-Flex Applications Duration: 90 minutes Abstract: Of course they bend and can be formed, but did you know that flexible circuit boards are lighter weight, more durable and more cost effective than a rigid board or wiring
Northland Electronic Sales was founded in 1986 upon on e important Goal, �To provide the vital link between client and principal by offering a professional sales organization exemplified by experience, technical knowledge and consistent sales achieve
New Equipment | Fabrication Services
MPCS specializes in building Flex and Rigid-Flex PCB's to the highest quality.
Up to 20 layers, 4 mil traces / spaces, 6 mil drilled holes and Book-bind capability. MIL-P-50884 approved for adhesiveless materials. Deliveries down to 3 days are available.
New Equipment | Assembly Services
Ideal for hand-held to large storage devices, Rigid Flex Circuits and Assemblies combine the benefits of flexible copper circuitry and rigid PCB circuitry into a unitized power and signal solution for superior reliability, system cost savings and opt
Flex Form Systems that form and trim SMD's one side at a time. Perfect for short runs and prototyping. System will provide adjustable form widths to devices from 1/4" to 2.0" and provide component height stand-offs from 0 1.25 inches.
Complete TTC Solutions for Electronics Applications Industry leaders within electronics and semiconductor manufacturing need to enable lean manufacturing, assure quality, and optimize efficient use of resources. Microscan products help these compan
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
