New SMT Equipment: todays vapor phase soldering (Page 1 of 2)

Flux Free Formic Acid Reflow Oven - 1936 MKV

Flux Free Formic Acid Reflow Oven - 1936 MKV

New Equipment | Reflow

Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form

Heller Industries Inc.

V3/V4/V5 vapor phase reflow oven

V3/V4/V5 vapor phase reflow oven

New Equipment | Reflow

V3/V4/V5 vapor phase reflow oven Model: V3/V4/V5  Product Description Product introduction: The name V3/V4/V5 is called according Vacuum , means professional industrial Vacuum reflow oven . Why chose Vacuum reflow oven? Recently ,the main weld

Beijing Torch Co.,Ltd

ASSCON GmbH  www.asscon.de

ASSCON GmbH www.asscon.de

New Equipment |  

The Company ASSCON Systemtechnik-Elektronik GmbH, was founded in 1995 as a development and manufacturing association for progressive and innovative Vapor Phase Reflow Soldering Systems. Today there are hundreds of ASSCON Vapor Phase Soldering System

Perel Oy

PTP® VP-8 Vapor Phase Thermal Profiling Solution

PTP® VP-8 Vapor Phase Thermal Profiling Solution

New Equipment | Reflow

The “PTP® VP-8” is a complete thermal profiling solution for the vapor phase solder process, using the award winning, M.O.L.E.® MAP software, in combination with the German-Engineered PTP® Vapor Phase profiler. This match-up provides all the power &

Electronic Controls Design Inc. (ECD)

SolderStar PRO VP - Vapor Phase Profiling System

SolderStar PRO VP - Vapor Phase Profiling System

New Equipment | Soldering - Other

Whether batch or inline, atmospheric or vacuum, the SolderStar solution for Vapor Phase machines allows engineers to understand and control their production vapour phases processes. Vapour phase soldering is not a new process, and with advanced machi

Solderstar

Advanced Thermal Management

Advanced Thermal Management

New Equipment | Assembly Services

S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with

S-Bond Technologies

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

NC257MD Jet Printing Solder Paste for Mycronic Jet Printers

New Equipment | Solder Materials

NC257MD solder paste has been specifically developed for Mycronic Jet Printers. Its unique rheological properties were engineered and validated through extensive testing in collaboration with Mycronic to provide continuous and consistent deposits. NC

AIM Solder

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

4300/LF-4300 Water Washable No-Clean Solder Paste

4300/LF-4300 Water Washable No-Clean Solder Paste

New Equipment | Solder Materials

Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,

AMTECH

Formic Acid Horizontal Reflow Oven h5

Formic Acid Horizontal Reflow Oven h5

New Equipment | Reflow

Formic Acid Horizontal Reflow Oven H5 Features Formic Acid Horizontal Reflow Oven H5: 1, high vacuum degree: 0.01 mbar high vacuum, vacuum degree of cavity numerical real-time display, and can control and adjust 2, vacuum pumping speed, after 50 m

Beijing Torch Co.,Ltd

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