New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
The GEM Topaz-X features a high precision single placement beam carrying 4 Flying Nozzle Change heads (each equipped with 3 nozzles) and 4 standard heads with exchangeable nozzles. The placement beam moves in X/Y and Z direction, while the board and
MP4 Mother Boards
New Equipment | Board Handling - Pallets,Carriers,Fixtures
SMT / PCB FIXTURES & TOOLING SMT PROCESS CARRIERS, WAVE SOLDER PALLETS, CONFORMAL COAT FIXTURES, PRESS FIT SUPPORT FIXTURES, REFLOW FIXTURES, SELECTIVE SOLDER FIXTURES, SURFACE MOUNT CARRIERS, AUTO INSERTION FIXTURES, WORKBOARD HOLDERS DEDICATED AND
EMC Global Technologies At EMC Global Technologies we manufacture fixtures and tooling for the processing of printed circuit board assemblies. FIXTURES Wave Solder Pallets Dedicated or Adjustabl
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Our Wave Solder Fixtures increase productivity and eliminate defects in your pcb assembly process. This type of fixture supports the pcb on all four sides eliminating warpage that can cause solder skips and bridges or pcb flooding. They also elim
New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
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