The revolutionary MAC2 series HD video inspection system from Scienscope merges the latest in HD video technology with the clearest macro video optics to provide an easy to use forward-looking inspection system for your most fatiguing and difficult t
The largest format AOI solution for large board sizes or backplane inspection. The Spectra Series Tri-Color Technology system is MVP’s large format AOI solution. The Spectra has a standard handling size of 24 x 24 inches (610 x 610mm). The optional
Discover the new Nokia 8800 phone. Created for your ultimate pleasure, its graceful looks and seamless functions will leave a lasting impression. Every aspect has been meticulously considered and precisely engineered; from the laser-cut curves of its
High-Mix, Medium Volume Automated Optical Inspection The Supra E is the class-leading, cost effective solution for all PCB manufacturers with PCBs up to 20” x 20”. MVP’s Quad-Color technology provides the ability to use multiple angles of light t
New Equipment | Assembly Services
Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
The MVP Selecta is a new product designed to complement your selective solder system and allows you to inspect the components soldered by your bottom-side soldering solution. MVP’s Selecta allows for full bottom-side inspection of all wave and reflow
New Equipment | Test Equipment - Bond Testers
The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Full automation, 0.075% accuracy, best ergonomics, highest throughput, vision options,
New Equipment | Test Equipment
Tebo-ICT is a kind of very professional ICT and ATE fixture software. Chinese interface, designed in humanity, compatible with Win98/2000/NT/XP/7/10 system, which is easy to operate and train. It can cope with all kinds of GERBER and buried via, posi
