New Equipment | Test Equipment
THE NEW GENERATION OF NANOINDENTER CSM Instruments has introduced a new nano range high resolution nanoindenter with ultra low thermal drift. When used per ISO 14577 test methods the Ultra Nano Hardness Tester will provide the most accurate data of
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
Convection reflow oven for PCBs with 5 zones on top and five bottom vertical heating zones, the NEW GF-125 HC/HT is an economic solution for automatic medium volume production runs. Utilizing horizontal convection heating technology, the GF-125 HC/H
Fuzion® is Universal’s flagship platform, leveraging the latest generation of head and feeder technologies, and software tools for maximum performance. Fuzion solutions maximize utilization, Overall Equipment Effectiveness (OEE), and productivity whi
New Equipment | Test Equipment
Keithley's SourceMeter family is designed specifically for test applications that demand tightly coupled sourcing and measurement. All source-measure models provide precision voltage and current sourcing as well as measurement capabilities. Each Sour
The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V
New Equipment | Test Equipment
The 2800 series of Huntron® Tracker® are designed to complement conventional test instruments in the debug and troubleshooting process. Using the proven power-off test method known as Tracker Signature Analysis it eliminates the risk of further circu
New Equipment | Education/Training
Business Industrial Network provides on site, customized Program Logic Controller (PLC training), for your maintenance and engineering staff. This is yet another way we are responding to our customers needs. Our survey of over 300 companies and corpo
Valor MSS seamlessly integrates the entire PCB manufacturing process with one easy-to-manage platform. Available as an end-to-end suite, each of the following modules may also be installed separately. One platform supports your entire manufacturing
NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for
