New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Assembly Services
Hanwha HM520 SMT Assembly Line Hanwha HM520 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 80000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
New Equipment | Assembly Services
Hanwha XM520 SMT Assembly Line Hanwha XM520 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 100000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place m
New Equipment | Assembly Services
JUKI RS-1R SMT Assembly Line JUKI RS-1R SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 47000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machin
New Equipment | Assembly Services
JUKI RS-1R SMT Assembly Line JUKI RS-1R SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 47000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machin
New Equipment | Assembly Services
JUKI RS-1R SMT Assembly Line JUKI RS-1R SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 47000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machin
The SPI 2500 is the next generation of off-line solder paste inspection system and features cost effective solution with the best accuracy. The optimal solution for monitoring and analysis of solder paste printing process. Measures Height, V
Automated Benchtop 3D Measurement & Analysis. VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and
VisionPro AP212 is a sophisticated 3D solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes training, an op
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
