Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
FOXBORO 11GM-CS1 PRESSURE XMTR FOXBORO 1210-03-D PHASE DET/AMP FOXBORO 130M-N2 PNEUMATIC CTRL FOXBORO 130M-N4 PNEUMATIC CTRL FOXBORO 130M-N5 PNEUMATIC CTRL FOXBORO 13A TRANSMITTER FOXBORO 13A1-MKS TRANSMITTER FOXBORO 13AH-S2 TRANSMITTER FOXBO
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