PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO
=, ■ Configurability of all available functions ■ C interface supplied for all popular compilers: GNU C/C++, 8051 compilers ■ No programming required ■ IEEE-754 Double precision real format support – double type ■ IEEE-754 Single precision real
PRO 1600-B is a benchtop full forced air convection reflow oven. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO 1600-B is very flexible in terms of profil
PRO 1600-RS is specifically configured for reflow simulation and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113F standard, Moisture Sensitivity Level (MSL) testing of semi
=, ■ Configurability of all available functions ■ C interface supplied for all popular compilers: GNU C/C++, 8051 compilers ■ C interface supplied for NIOS II and MICROBLAZE processors ■ No programming required ■ IEEE-754 Double precision real
=, ■ C interface supplied for all popular compilers: GNU C/C++, 8051 compilers ■ No programming required ■ IEEE-754 Single precision real format support – float type ■ Flexible arguments and result registers location ■ Performs the following fu
=, ■ C interface supplied for all popular compilers: GNU C/C++, 8051 compilers ■ No programming required ■ IEEE-754 Single precision real format support – float type ■ 16-bit word and 32-bit short integers format supported – integer types ■ Fle
High Performance 3-D Solder Paste Inspection with Quality Uplink Extremely fast and highly accurate in-line inspection Viscom's S3088 SPI inspection system is an extremely fast and highly precise inline system for 3-D solder paste inspection. The 3
Reliable optical inspection of wave, reflow, pre-reflow and selective soldering. More than an entry into AOI Optimal, ergonomic loading through large opening angle Superior resolution, reliable 01005 and fine-pitch inspection Scalable camera t
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
