Antennas exist in all communication equipment and in a broad range of electronics. The industries that use antennas range from telecom to medical industry to military applications. Current antennas are much smaller than previous generations and, in m
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
New Equipment | Surface Finish
Surface Treatment: Cleans, Ablates, Promotes Adhesion Atmospheric plasma treatment is a unique technology for surface treatment in electronic assembly: Nano-Cleaning, Removal of Organic Contaminants, Surface Activation/Modification, Surface Ablation
Syagrus Systems uses the 3M Wafer Support System to meet the demands of today's technology companies for extremely thin silicon wafers and die used in complex applications. We have over 15 years of silicon wafer thinning and wafer backgrinding experi
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