When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Unparalleled Dispensing Accuracy The CHAMPION 6809 is a servo driven, automatic dispensing system designed for precision processes. The system can be configured to match exacting application requirements from dots to under fill with a broad array of
PRISM is the new Reliability Analysis Center (RAC) software tool that ties together several tools into a comprehensive system reliability prediction methodology. The PRISM concept accounts for the myriad of factors that can influence system reliabil
PRISM is the new Reliability Analysis Center (RAC) software tool that ties together several tools into a comprehensive system reliability prediction methodology. The PRISM concept accounts for the myriad of factors that can influence system reliabil
Product name jumbo bag/FIBC/big bag/bulk sack/container bag/Ton bag/super sack Material type 100% pp virgin or lamination fabric Construction 4-panel/U-panel/circular/Tubular/rectangular shape ton Jumbo Bag Fabric weight 140gsm/160gsm/180gsm
New Equipment | Cleaning Equipment
Aqueous and Semi-Aqueous PCB Cleaning Systems The MicroJet™ Inline cleaning System with Progressive Energy Dynamics™ provides the highest level of SMT cleaning available on the market today. Progressive Energy Dynamics (PED™) is a proprietary spray
Users can now spend under $800.00 USD and receive a feature-filled DMM with 11 measurement and 8 math functions. Other important considerations are its noise immunity, USB with 2000 measurements and transfers/sec 10-channel scan option, temperature m
Formic Acid Horizontal Reflow Oven H5 Features Formic Acid Horizontal Reflow Oven H5: 1, high vacuum degree: 0.01 mbar high vacuum, vacuum degree of cavity numerical real-time display, and can control and adjust 2, vacuum pumping speed, after 50 m
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
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