Cermet Thick Film Materials, Au & Al Wire for Wirebonding, Flip Chip Underfills, Encapsulants, Potting Compounds, Paste & Film Adhesives, COB Die Attach, Solder Alternatives, Conformal Coatings, Vacuum Pick-up Tool, W/B Capallaries and Die Collets
The MicroMesh Stencil System is a unique advanced stencil system explicitly designed and constructed to provide high precision in printing, especially when printing thicker deposits up to and in excess of 500 microns in height. Whether you are workin
The MicroMesh Stencil System is a unique advanced stencil system explicitly designed and constructed to provide high precision in printing, especially when printing thicker deposits up to and in excess of 500 microns in height. Whether you are workin
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
i-TECH ASYMTEK - Fluid Dispensing & Conformal Coating BTU - Reflow & Cure Oven Technology COGISCAN - Material/Component Tracking CYBEROPTICS - 3D Print Inspection, AOI Inspection ECMG - Printed Circuit Board Technologies
i-TECH ASYMTEK - Fluid Dispensing & Conformal Coating BTU - Reflow & Cure Oven Technology COGISCAN - Material/Component Tracking CYBEROPTICS - 3D Print Inspection, AOI Inspection ECMG - Printed Circuit Board Technologies
Dispensing Equipment for Small Batches and Rework Micro dispensing for small batches and rework. Precisely dispense solder paste, epoxy and underfill with the highest consistency, even for the smallest dots. For 25 years MARTIN have been setting
New Equipment | Rework & Repair Equipment
Underheater for demanding soldering Applications for underheaters range from pre-heating of PCBs for hand soldering tasks over pre-heating for automated machine rework to curing or cracking of underfill. MARTIN offers a wide choice of underheater
i-DR A252 configured with the most complete, and advanced features among the series to support today’s various dispensing markets and applications. This series with NDisp3WIN software is ideally for high volume production applications that need
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
