New SMT Equipment: universal 6.0

Smt I-pulse K01 nozzle used in pick and place machine

Smt I-pulse K01 nozzle used in pick and place machine

New Equipment | Pick & Place

Smt I-pulse K01 nozzle used in pick and place machine Smt I-pulse K01 nozzle used in pick and place machine I-pulse series nozzles: 1.M1/M4 type:M001/M002/M003/M004/M005/M006/M012/M013/M017/M018/M019/M020/M021/M022/M031/M032/M033 2.M2 type:N001/N00

ZK Electronic Technology Co., Limited

JUKI Nozzle for 700&2000 series

JUKI Nozzle for 700&2000 series

New Equipment | Pick & Place

JUKI Nozzle for 700&2000 series KD775&780E3401-802-000JUKIKD775 DISP NZ S2D/1S 0.6/0.3P=0.7E3406-802-00JUKI KD775 DISP NZ M1D/2S 0.7/0.4P=1.0E3411-802-000JUKI KD775 DISP NZ L1D/1S 0.9/0.6P=1.5E3416-802-000JUKI KD775 DISP NZ LL 2D/2S 0.9/0.6P=1.5E342

ZK Electronic Technology Co., Limited

Smt Hitachi nozzles sigma-G4 Sigma-G5 nozzles used in pick and place machine

Smt Hitachi nozzles sigma-G4 Sigma-G5 nozzles used in pick and place machine

New Equipment | Pick & Place

Smt Hitachi nozzles sigma-G4 Sigma-G5 nozzles used in pick and place machine Hitachi GXH-1, GXH-3 Nozzles Part Number            Description 630 128 4842 (#101)        HA01 0.7x0.4/ø0.25 (for 0603) 630 132 2322 (#111)        PV01 1.1x0.6/ø0.38 (for

ZK Electronic Technology Co., Limited

High Tg PCB

High Tg PCB

New Equipment |  

1. FR-4 Tg170 2. 20 layer, 1.6mm thick 3. 1 oz copper finished 4. 10% impedance control 5. Blind/buried vias 6. 0.1mm holes, HDI 7. Application: telecommunication, industrial control, medical equipment

Bicheng Enterprise Company

metal core pcb

metal core pcb

New Equipment | Other

Double-sided Aluminium PCB Layer count: 2 Material: Bergquist HT-04503 Aluminum Board thickness: 1.6mm Copper thickness: 1oz Thermal conductivity: 2.2W/m-K Breakdown voltage: 6.0KV Application: LED light

A-Tech Circuits Co.,Limited

Mass-Production-PCB-1-22layers

Mass-Production-PCB-1-22layers

New Equipment |  

1-22 Layers PCBs FR-4, Rogers, High Tg FR4, CEM-1, CEM-3, etc. Material 0.4-6.0 mm Board Thickness Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Treatment Green, Red, White, Yellow, Black, Blue Solder Mask

Shenzhen Longkun Technology Co.,Ltd

HDI PCB

HDI PCB

New Equipment | Other

High-density interconnection/HDI PCB Layer: 8 (HDI) Structure: 2+4+2 with stack via Material: FR4(Tg170) Thiness: 1.0mm Surface treatment: Selective immersion gold + OSP Blind via L1-2 & L2-3 & L6-7 & L7-8: 0.1MM (4mil) Buried via L3-6:

A-Tech Circuits Co.,Limited

Laminates

Laminates

New Equipment |  

We can supply Copper Clad Laminates used in manufacture of Printed Circuit Boards meeting international standards from India. Laminate Types : CEM1, CEM3, FR1, FR2, FR3, FR4 and Flexible. Thickness : 0.2 mm - 6.0 mm Copper Cladding : 1

3Wi Technologies

Printed Circuits

Printed Circuits

New Equipment |  

Printed Circuit Boards meeting international standards are available from Indian Printed Circuit Board manufacturer. Complete range of UL approved products : Base Laminate : CEM1 , CEM3, FR3, FR4 and FR1, FR2, Flexible. Thickness

3Wi Technologies

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Wave Soldering 101 Training Course
Circuit Board, PCB Assembly & electronics manufacturing service provider

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Win Source Online Electronic parts

World's Best Reflow Oven Customizable for Unique Applications


500+ original new CF081CR CN081CR FEEDER in stock