Lightspeed provides state of the art electronics assembly services, including through hole, hand assembly, box build, and mechanical product assembly. We offer the responsiveness and flexibility of a small company with the wealth of experience and
Higher throughput reflow oven with 20" (508mm) wide conveyor for production runs. The 2000HT reflow oven utilizes our patented Horizontal Convection Heating technology for extremely uniform temperature profiling across the board for enhanced process
Introducing TNR and TAR model. Supports Pb free soldering.
The SF Lead-Free Reflow Oven Series provides higher throughput with a choice of eight (8), ten (10), or twelve (12) heating zones and 17.7" (450mm) adjustable wide conveyor for production runs. Utilizing our patented Horizontal Convection Heating t
Reflow oven with five (5) top and five (5) bottom vertical heating zones, the ERO-500 is an economic solution for low to medium volume production runs. Utilizing plenum convection heating technology, the ERO-500 provides uniform temperature profilin
Reflow oven utilizing our 100% patented forced air Horizontal Convection™ Heating technology provides for greater thermal uniformity and process control. The GF-12HT is lead -free compatible for RoHS compliant soldering. 100 menu profile storage
PROSEM Technology Inc. also represents SUNEAST, a Hong Kong based SMT equipment manufacturer for their Solder Paste Printers and Reflow Ovens. the Solder Paste Printers cover the complete range from Semi-Automatic without vision, through Semi-Automat
5-12 Zone systems available Lead free capable Air or N2 Option Mesh and edge rail Auto hood lifts L-R or R-L product travel 208-480 VAC options Computer controlled
Cost-effective batch reflow oven utilizing forced air convection heating technology with individual time and temperature controls makes profile set up quick and easy. The GF-B-HT is a high temperature model capable of lead and lead-free soldering.
Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
