New SMT Equipment: used ionic contamination tester (Page 1 of 2)

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

Mega™ ION Batch PCB Cleaners

Mega™ ION Batch PCB Cleaners

New Equipment | Cleaning Equipment

World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel Construction Automatic Wash/Rinse/Test/Dry 230VAC, 10AMP, 50/60Hz

Austin American Technology

CM Series (Contaminometer™) Cleanliness Testers

CM Series (Contaminometer™) Cleanliness Testers

New Equipment | Test Equipment

For over 40 years the Benchmark for Ionic Contamination Testing Commonly referred to "Cleanliness Testing" as this test method has, for over 40 years, been acknowledged as an important Quality Assurance and Process Control tool in the manufacture of

Gen3 Systems

Lite Fast 2081

Lite Fast 2081

New Equipment |  

Lite Fast 2081, a UV encapsulant, was specifically developed to relieve the stress placed on toroidal coils or electronic components that will experience pressure during the molding process. With a durometer Shore D hardness of 5, the UV encapsulant

MLT/Micro-Lite Technology

GlobalTech® SMT Aqueous Stencil Cleaner

GlobalTech® SMT Aqueous Stencil Cleaner

New Equipment | Cleaning Agents

Heavy Duty Degreaser (HDD) GlobalTech® Heavy Duty Degreaser (HDD) is an aqueous cleaner that is more than 90% water based with all ingredients being 100% active. It has been specially formulated to remove all types of grease, oil, grime, and dirt f

JNJ Industries, Inc.

Electrically Conductive Adhesives

Electrically Conductive Adhesives

New Equipment | Materials

For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring

Zymet, Inc

TREK Industries, Inc.

TREK Industries, Inc.

New Equipment |  

TREK INDUSTRIES is a recognized leader in cleaning equipment for the most demanding applications. This experience in controlled process and precision cleaning has become valuable in working with many critical cleaning applications such as printed ci

Trek Industries

TREK Industries, Inc.

New Equipment |  

TREK INDUSTRIES is a recognized leader in cleaning equipment for the most demanding applications. This experience in controlled process and precision cleaning has become valuable in working with many critical cleaning applications such as printed ci

Trek Industries

UV Curable Glob Top and Dam-and-Fill Encapsulants

UV Curable Glob Top and Dam-and-Fill Encapsulants

New Equipment | Materials

For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline

Zymet, Inc

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

ASKbobwillis.com

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