New SMT Equipment: used wedge bonder (Page 1 of 4)

HeatShields™ Ceramic Thermal Shielding Material for PCB Rework

HeatShields™ Ceramic Thermal Shielding Material for PCB Rework

New Equipment | Rework & Repair Equipment

Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a

BEST Inc.

2470-V Automatic Wedge Bonder

New Equipment |  

Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames.

Palomar Technologies

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

New Equipment | IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia

Hesse Mechatronics

Ultrasonic Engineering   Al Wedge Wire Bonder

Ultrasonic Engineering Al Wedge Wire Bonder

New Equipment |  

Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual

Tanaka Corporation

Manual Wire Bonder

Manual Wire Bonder

New Equipment | Other

For Wire Bonding (Wedge and Ball Bonding)

K-Net International Ltd.,Part

Microelectronics Packaging

Microelectronics Packaging

New Equipment | Assembly Services

The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to

STI Electronics

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

New Equipment | Inspection

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

Single Splice Tape w/Edge Alignment

New Equipment | Pick & Place

Single splice tape w/edge alignment (K.0208.1, K.0212.1, K.0216.1, or K.0224.1) is used for splicing together the cover tape of either 2 reels of taped components, or 2 strips of taped components. Single splice tape is usually used in conjunction wit

Smart Splice LLC

Double Splice Tape w/Edge Alignment

New Equipment | Pick & Place

Double splice tape (K.0108.3, K.0112.3, K.0116.3, or K.0124.3) is used for splicing together the top and bottom cover tape or cover tape and pocket bottoms of either 2 reels of taped components, or 2 strips of taped components. Double splice tape can

Smart Splice LLC

Semiconductor Tools

New Equipment |  

Front End: Previously owned (new & used) equipment used for fabrication of semiconductor wafers and similar devices. Includes coater/developers, CVD, PECVD, etch tools, steppers, sputtering tools, ashers, evaporators. Back End: Previously owned (

ECD Tools Inc.

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