Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
New Equipment | Coating Materials
HumiSeal produces conformal coatings from all chemistries, including acrylics, urethanes and silicones, both water based and UV curable. This represents the widest product range and the largest choice of qualified products currently available. We ar
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
New Equipment | Curing Equipment
iCure-2UV is a compact, inline UV curing system. The UV curing oven is suitable for high intensity, rapid curing of UV curable coatings, adhesives, and inks. Standard Features: Edge carrying, variable speed pin chain conveyor Rail expansion comp
Specifically engineered for water resistance on printed circuit board protection and LED component protection in membrane switches. Surface Resistivity: 3.8 x 1014 ω/■ Insulation resistance of cured films of UV-3010 at 100°C and 95% relative h
Lite Fast SR-1000, a UV Solder Mask, was designed to screen print over conductive traces, landing pads, resistors, fuses and capacitors on Printed Circuit Boards (PCBs) and ceramic substrates. Other applications include metal and various plastics.
Lite Fast 2081, a UV encapsulant, was specifically developed to relieve the stress placed on toroidal coils or electronic components that will experience pressure during the molding process. With a durometer Shore D hardness of 5, the UV encapsulant
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
Table-Top Configuration Adjustable Vacuum Contact Or Proximity Printing Precision Alignment Module For Piece Parts Up to 8" Square, .005" to .3" Thick Top (2" to 10") And Bottom (2" to 8") Vacuum Mask Holders Fixed Level Or Wedge Compensation (Pla
