New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
VGB-450 Daheng Under vacuum potting system By potting under vacuum, components can be optimally protected from external influences. Before the potting process, air and moisture are removed from the components by vacuum. Components with geometries th
New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Testing voltage: 50 to 300V Packing: vacuum packing for PCB, and good condition outer boxes
MS-T02 Conductive bag Surface resistance:��104-106�� MS-T03 ESD lattice bag Surface resistance: ��104-106�� MS-T04 ESD and moisture-Proof vacuum packing bag Surface resistance����1011�� MS-T05 ESD PE bag Surface resistance:��1011�� MS-T
New Equipment | Assembly Services
1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20s Test voltage: 50 to 300V Package: vacuum packing for PCB, and good condition outer box; attached strong strap to reinforce outer box
25.0µm (>1 mil) Packing: Inner packing: vacuum packing/plastic bag Outer packing: standard carton packing Shape tolerance: ±0.13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05 With UL, SGS and RoHS marks Special requirements: buried and blind via +
New Equipment | Selective Soldering
Pillar Orissa Synchrodex single Point, in line, Soldering Machine, Nitrogen generation system and vacuum packing Max.size18 x24” (257mmx610mm) min 4”x4” Dual flux assembly Top side IR pre heat with Closed loop pyrometer setting laser Windows ba
√ Technological Capabilities No. Items technological Capability 1 Layer 1-2
New Equipment | Assembly Services
25.0 um (>1mil) 6Max. Board Size: (580mm×1200mm) 7Min. Drilled Hole Size:4mil(0.1mm) 8Min. Line Width:3mil (0.075mm) 9Min. Line Spacing:3mil (0.075mm) 10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/
Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Multilayer Mixed Dielectric PCB Specifications:
