New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Adjustable pin chain conveyors, 4 zone preheat section, horizontal reflow position, left to right product flow, touch screen operation, fully integrated controls, SMEMA upstream/downstream interface, bar code capability and all the standard features
The Company ASSCON Systemtechnik-Elektronik GmbH, was founded in 1995 as a development and manufacturing association for progressive and innovative Vapor Phase Reflow Soldering Systems. Today there are hundreds of ASSCON Vapor Phase Soldering System
R&D Technical Services offers a full line of Single Vapor Reflow Systems. The RD10 provides consistent, uniform and reliable heat transfer in a Belted Inline application for high quality reflow, curing and drying. The RD10 utilizes user friendly cont
The R&D Technical Services VRS unit was specifically designed to treat the external exhaust of reflow systems. The VRS is used to minimize fluid consumption which significantly reduces operating costs. APPLICATION: The model VRS is a high performance
New Equipment | Solder Materials
Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,
R&D Technical Services Inc. offers a full line of Single Vapor Batch Type Reflow Systems. The RD1 provides consistent, uniform and reliable heat transfer for high quality reflow, curing and drying. The RD1 utilizes Programmable Logic Controls coupled
New Equipment | Solder Paste Mixers
Mixes and softens solder paste in original containers. Improves printing consistency, print quality, and saves time! Reduces oxidation and prevents the potential introduction of foreign matter and water vapor into the paste. Equipped with easy to
New Equipment | Assembly Services
S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with
New Equipment | Solder Paste Mixers
Unique contoured shape, generous appearance and practical, which is made by advanced coating process workmanship. Mixing principle is on the basis of Motor rotation and revolution mode of agitation, no need to defrost the paste. Need to recovery the
