New SMT Equipment: vapor soldering (Page 1 of 2)

ASSCON GmbH  www.asscon.de

ASSCON GmbH www.asscon.de

New Equipment |  

The Company ASSCON Systemtechnik-Elektronik GmbH, was founded in 1995 as a development and manufacturing association for progressive and innovative Vapor Phase Reflow Soldering Systems. Today there are hundreds of ASSCON Vapor Phase Soldering System

Perel Oy

Aluminum Tapes

Aluminum Tapes

New Equipment | Components

The unique electrical, thermal and mechanical properties of aluminum combined with Polyonics proven coating, adhesive and manufacturing technologies provide high quality tape material ideal for high temperature applications. In particular, Polyonics

Polyonics, Inc.

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

Genitec GAM 60 Solder Paste Mixer

Genitec GAM 60 Solder Paste Mixer

New Equipment | Solder Paste Mixers

Mixes and softens solder paste in original containers. Improves printing consistency, print quality, and saves time! Reduces oxidation and prevents the potential introduction of foreign matter and water vapor into the paste. Equipped with easy to

Christopher Associates Inc.

Advanced Thermal Management

Advanced Thermal Management

New Equipment | Assembly Services

S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with

S-Bond Technologies

Flame Retardant Tapes

Flame Retardant Tapes

New Equipment | Components

The Fire Problem The Flame ProblemThe ever-increasing and widespread use of electronic devices, such as laptops, tablets, personal digital assistants (PDA’s) and smart phones is requiring longer and longer battery life. The batteries become increas

Polyonics, Inc.

OB-M628 Solder Paste Mixer

OB-M628 Solder Paste Mixer

New Equipment | Solder Paste Mixers

Unique contoured shape, generous appearance and practical, which is made by advanced coating process workmanship. Mixing principle is on the basis of Motor rotation and revolution mode of agitation, no need to defrost the paste. Need to recovery the

Shenzhen Oubel Technology Co.,Ltd

4300/LF-4300 Water Washable No-Clean Solder Paste

4300/LF-4300 Water Washable No-Clean Solder Paste

New Equipment | Solder Materials

Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,

AMTECH

ErgoSonic - Automatic / Closed loop Stencil & Pallet Cleaner

ErgoSonic - Automatic / Closed loop Stencil & Pallet Cleaner

New Equipment | Cleaning Equipment

The first ergonomicly designed front-loading ultrasonic stencil cleaner The ErgoSonic Model Stencil & Pallet Cleaner is fully automatic and programmable. The operator loads the stencil into an empty chamber and selects the desired cleaning profile.

Smart Sonic Stencil Cleaning Systems

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

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