New Equipment | Soldering - Other
ASSCON Vapor Phase Soldering: ASSCON VP2100 Vacuum, ASSCON VP800 Vacuum, ASSCON VP6000 Vacuum & ASSCON VP7000 Vacuum
PCB Reflow Oven Machine I.C.T Lyra Series I.C.T Lyra Series Reflow Oven is made with Nitrogen Standard. Customer can add nitrogen at any time in future I.C.T brings 26 years of experience in the SMT industry. On-site installation and training Availa
The Company ASSCON Systemtechnik-Elektronik GmbH, was founded in 1995 as a development and manufacturing association for progressive and innovative Vapor Phase Reflow Soldering Systems. Today there are hundreds of ASSCON Vapor Phase Soldering System
The “PTP® VP-8” is a complete thermal profiling solution for the vapor phase solder process, using the award winning, M.O.L.E.® MAP software, in combination with the German-Engineered PTP® Vapor Phase profiler. This match-up provides all the power &
New Equipment | Soldering - Other
Whether batch or inline, atmospheric or vacuum, the SolderStar solution for Vapor Phase machines allows engineers to understand and control their production vapour phases processes. Vapour phase soldering is not a new process, and with advanced machi
The main model of the CIF by Exmore range is the vapor phase VS-500.IV. The concept of the machine allows to solder even the most complex cards of a format of 500 x 500 x 60 mm while ensuring optimal quality thanks to, • The inert atmosphere re
ASSCON vapor phase reflow soldering systems set standards in soldering technology. The VP 7000 vacuum systems are based on advanced patented high-tech soldering methods, and offer outstanding soldering quality in large series productio
New Equipment | Soldering - Other
VP Nano system allows engineers to capture thermal profiles of complex electronic assemblies that utilise numerous components or require higher mass PCB substrates. Thanks to its innovative design, the system will streamline the periodic checking of
ASSCON’s vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal f
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
