New SMT Equipment: via cap seperation (Page 1 of 1)

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

Zeta™ Cap - Ultra Thin, High Performance PCB Cap Material

New Equipment | Materials

500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo

Integral Technology, Inc

AB DCS 1747 1786

AB DCS 1747 1786

New Equipment |  

MFR. PART NUMBER DESCRIPTION ALLEN BRADLEY 1747-ACN15 CONTROLNET 1.5 AND BEYOND 171 I/O ADAPTER ALLEN BRADLEY 1747-ACNR15 CONTROLNET 1.5 AND BEYOND 171 I/O ADAPTER ALLEN BRADLEY 1747-AIC ISOLATED LINK COUPLER FOR PLC ALLEN BRADLEY 1747-ASB SLC 50

zhengzhou yuzhe electronic technology co.,ltd

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