New SMT Equipment: via in pads (Page 1 of 3)

PCB Loader/PCB Unloader in SMT Line

PCB Loader/PCB Unloader in SMT Line

New Equipment | Board Handling - Conveyors

Microcomputer control, stable and reliable. >LCD screen display, menu interface, the man-machine dialogue is convenient. >Many sound-light alarm function. >So can use standard feeder, strong commonality. >According to the thickness of the PCB so

I.C.T ( Dongguan ICT Technology Co., Ltd. )

HTC - 300 High Temperature Carbon Ink for Screen Printing in Flex Circuits

HTC - 300 High Temperature Carbon Ink for Screen Printing in Flex Circuits

New Equipment | Materials

HTC-300 is designed for screen printing in flex circuit and printed electronic applications where stable resistance values at elevated temperatures are required. Utilizes a high Tg (glass transition temperature) thermoplastic copolymer binder fo

Conductive Compounds, Inc.

Via-in-Pad

Via-in-Pad

New Equipment | Assembly Services

10-Layer Via-in-Pad Technology PCB features blind via in L9-10 in addition to the Fine Pitch BGA. Putting the via in the pad creates space on the external layers for more routing and avoids potential shorts during assembly. The routing channel widt

Saturn Electronics Corporation

Multilayer PCB

Multilayer PCB

New Equipment | Components

600V            *RO4350B        *RO4003C                     Dielectric material & Stack up requirement FR-4(no copper): 0.05-3.2mm for option Prepreg type: 7628H(7630), 7628(43%), 7628(41%), 2116HR, 2116, 2113, 1080 and 1060 for option Copper

Bicheng Enterprise Company

Multilayer PCB

Multilayer PCB

New Equipment | Inspection

Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width

Multycircuit Technology Limited

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

Power PCB

Power PCB

New Equipment | Design Services

Layer:4 Material:FR-4 4/4/4/4oz Thickness:2.0 Minimum hole:0.35mm Minimum Tracc/Spacing:12mil/15mil Application:power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:  

Multycircuit Technology Limited

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

PCB prototypes

PCB prototypes

New Equipment | Components

Bicheng provides RD, high-tech, IT research companies and organizations, large or small with high quality bare PCB's PCB Products & Services * FR-4, High TG170, High CTI 600V                                   * MCPCB, 1W/mk- 3W/mk * High speed

Bicheng Enterprise Company

PCB Manufacturing - USA

PCB Manufacturing - USA

New Equipment | Assembly Services

Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e

PNC Inc.

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