New SMT Equipment: virtual profile (Page 1 of 2)

Heller 2049 MK7 SMT Reflow Oven

Heller 2049 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2049 MK7 SMT Reflow Oven Heating Zones: Top 15/ Bottom 15PCB Width:50 - 560 mmProduct description: Heller 2049 MK7 SMT Reflow Oven, Heating Zones: Top 15/ Bottom 15, PCB Width:50 - 560 mm   Heller 2049 MK7 SMT Reflow Oven Heller 2049 MK7

Qersa Technology Co.,ltd

Heller 2156 MK7 SMT Reflow Oven

Heller 2156 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 2156 MK7 SMT Reflow Oven Heating Zones: Top 17/ Bottom 17PCB Width:50 - 560 mmLength: 869cmProduct description: Heller 2156 MK7 SMT Reflow Oven, Heating Zones: Top 17/ Bottom 17, PCB Width:50 - 560 mm, Length: 869cm   Heller 2156 MK7 SMT R

Qersa Technology Co.,ltd

Heller 1826 MK7 SMT Reflow Oven

Heller 1826 MK7 SMT Reflow Oven

New Equipment | Reflow

Heller 1826 MK7 SMT Reflow Oven Heating Zones:Top 8 / Bottom 8PCB Width:50 - 560 mmWeight: 1970 kgDimension: W4650 x D1520 x H1440 mmProduct description: Heller 1826 MK7 SMT Reflow Oven, Heating Zones:Top 8 / Bottom 8, PCB Width:50 - 560 mm, Weight:

Qersa Technology Co.,ltd

SuperM.O.L.E.® Gold 2  Flux and Wave Solder Thermal Profilers

SuperM.O.L.E.® Gold 2 Flux and Wave Solder Thermal Profilers

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G

Electronic Controls Design Inc. (ECD)

KIC Auto-Focus Power - Thermal Process Optimization Software for Reflow Ovens

KIC Auto-Focus Power - Thermal Process Optimization Software for Reflow Ovens

New Equipment | Reflow

Conveniently view and share profiles on mobile devices Software Description Auto-Focus Power™ is a ‘recipe search engine’ with an intelligent database Every manual profile will populate the database. The correlations between the oven properties,

KIC Thermal

M.O.L.E.® Reflow Oven Thermal Profilers

M.O.L.E.® Reflow Oven Thermal Profilers

New Equipment | Reflow

Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G

Electronic Controls Design Inc. (ECD)

AUTOSeeker - Reflow Profile Optimization Software

AUTOSeeker - Reflow Profile Optimization Software

New Equipment | Reflow

This powerful simulation tools enables the user to make virtual changes to temperature and conveyor speed parameters and view the effects of those changes on the thermal profile and process. The procedure is offline so it does not impact real product

Solderstar

ProtoFlow S - Lead-Free Reflow Oven

ProtoFlow S - Lead-Free Reflow Oven

New Equipment | Reflow

Ideal for in-house Rapid PCB Prototyping The ProtoFlow S is LPKF's premiere convection oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow S features even heat distribution, e

LPKF Laser & Electronics

ProBot Automatic Profiling System

ProBot Automatic Profiling System

New Equipment | Reflow

The Profiling Machine for your Profile Machine The ProBot automatically verifies whether each PCB is processed to specification in the reflow oven. The suspect PCBs then can be sent off to batch X-ray. Because the typical batch X-ray machine only in

KIC Thermal

SMS Linecontrol� :

SMS Linecontrol� :

New Equipment |  

THE FUTURE IN SURFACE MOUNT MACHINE CONTROL. The unique structure and performance of Linecontrol� automates many of the process steps involved in programming, optimizing and balancing a line, massively reducing downtime and potential operator e

Specialised Manufacturing Solutions Ltd

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