Develop complete applications with ease The JTAG ProVision software suite is used to generate boundary-scan tests and in-system programming applications for assembled PCBs and systems. This professional development tool is fully automated and suppo
Lightspeed provides state of the art electronics assembly services, including through hole, hand assembly, box build, and mechanical product assembly. We offer the responsiveness and flexibility of a small company with the wealth of experience and
MobilEye develops driving assistance systems based on a single video camera. As a result, there is no need for multiple cameras calibration and synchronization. The novel video analysis algorithms achieve unmatched performance in poor lighting, rain
Altronics has a flexible process that can cost effectively handle low volume high-mix, through mid volume production manufacturing. PROTOTYPES: We will work closely with you to quickly turn around your PCB printed circuit board prototype assemblies
The NPI center's primary functions are rapid design validation, identifying DFM enhancements and cost reduction opportunities and facilitating a smooth transfer to production. The self-contained work-cells include staff dedicated solely to prototype
Left: This part looked ok to the naked eye. Right: A microscopic view shows evidence of this part being previously soldered or reworked. Another part caught and prevented from being a potential problem for our customer. Decapsulation, Pinpri
New Equipment | Test Equipment
Acculogic offers commercial functional test systems for a broad range of manufacturing test applications, including automotive and military-aerospace. Designed for production testing, our solutions are optimized for throughput, reliability, repeatabi
New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM
Improve manufacturing operations and decision making based on real time shop-floor information Achieve goals for on-time delivery, eliminated waste, asset utilization, first pass yield, DPMO and total traceability. Valor IoT manufacturing collects
