New Equipment | Rework & Repair Services
Reliable LGA Rework Services to Rescue Your Project BEST is your source for LGA rework services. We can optimize our processes to make sure voiding is minimized and the interconnection to all of the IO meets the IPC classification for the assembly.
New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
New Equipment | Rework & Repair Services
BEST offers contract PCB rework services. If you get in bind and need resources to perform difficult repairs or if the volume of work ahead of you is too extreme to get through in the deadline at hand then consider BEST PCB rework services. If you th
BGA & QFN Inspection Made Easy! The new BGA Inspector is a standalone software tool capable of analyzing images from different radiography systems. The BGA Inspector is unique in its ability to quickly and easily producing the results you need to v
The perfect solution for a cost-effective yet powerful x-ray inspection system. The TruView™ Prime is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. The TruView Pri
New Equipment | Soldering - Other
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
VJ Electronix leads the way in providing robust and practical X-ray solutions to solve real production issues. Innovation and simplicity govern system design to maximize ease-of-use with programmed inspection and a simple 1–2–Go! user int
New Equipment | Solder Materials
Big-Size Vacuum Soldering Oven for IGBT, MOS 1.Reflow soldering Typically high number of voids cause a large non conductive area 2.Vacuum soldering Very low number of voids, Typically 3.Applications Power Semiconductors;Hybrid
New Equipment | Solder Materials
V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature
