New SMT Equipment: void area (Page 1 of 2)

BGA Inspector

BGA Inspector

New Equipment | Software

BGA & QFN Inspection Made Easy! The new BGA Inspector is a standalone software tool capable of analyzing images from different radiography systems. The BGA Inspector is unique in its ability to quickly and easily producing the results you need to v

Creative Electron Inc

TruView™ Prime - The Most Powerful Benchtop X-ray Inspection System

TruView™ Prime - The Most Powerful Benchtop X-ray Inspection System

New Equipment | Inspection

The perfect solution for a cost-effective yet powerful x-ray inspection system. The TruView™ Prime is a fully motorized radiography system developed to meet the stringent requirements of electronics assembly and component inspection. The TruView Pri

Creative Electron Inc

VERTEX II Next Generation Affordable X-ray Inspection

VERTEX II Next Generation Affordable X-ray Inspection

New Equipment | Inspection

VJ Electronix leads the way in providing robust and practical X-ray solutions to solve real production issues. Innovation and simplicity govern system design to maximize ease-of-use with programmed inspection and a simple 1–2–Go! user int

VJ Electronix

X-Scope 6000 Cabinet X-Ray Inspection System

X-Scope 6000 Cabinet X-Ray Inspection System

New Equipment | Inspection

130kV, 5 Micron Microfocus X-Ray Inspection System The X-SCOPE 6000 is digitally full programmable CNC controlled x-ray inspection system that allows operators to program inspection and measurement routines with point and click ease. Standard featu

SCIENSCOPE International

Indium8.9 Pb-Free Solder Paste

Indium8.9 Pb-Free Solder Paste

New Equipment | Solder Materials

Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t

Indium Corporation

SACM™ Soldering Alloy

SACM™ Soldering Alloy

New Equipment | Solder Materials

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to

Indium Corporation

NC676 - No Clean Solder Paste

NC676 - No Clean Solder Paste

New Equipment | Solder Materials

NC676 No Clean Solder Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time

FCT ASSEMBLY, INC.

WS159 - Water Soluble Solder Paste

WS159 - Water Soluble Solder Paste

New Equipment | Solder Materials

WS159 water washable solder paste is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in PCB Assemblies. WS159 offers high levels of repeatability and consistency even in a wide range of

FCT ASSEMBLY, INC.

ePaste Lead-Free Solder Paste

ePaste Lead-Free Solder Paste

New Equipment | Solder Materials

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a

Nihon Superior Co., Ltd.

Thermodime - Diamond Interface Material

Thermodime - Diamond Interface Material

New Equipment |  

Thermodime� diamond heat transfer compound from Electrospell is an ultra high thermal conductivity thermal interface material composed of pure surface-modified diamond microcrystals suspended in a special carrier fluid. The product comes in a 1 ml sy

Electrospell

  1 2 Next

void area searches for Companies, Equipment, Machines, Suppliers & Information