Heller 1826 MK7 SMT Reflow Oven Heating Zones:Top 8 / Bottom 8PCB Width:50 - 560 mmWeight: 1970 kgDimension: W4650 x D1520 x H1440 mmProduct description: Heller 1826 MK7 SMT Reflow Oven, Heating Zones:Top 8 / Bottom 8, PCB Width:50 - 560 mm, Weight:
Heller 2043 MK7 SMT Reflow Oven Heating Zones: Top 13 / Bottom 13PCB Width: 50 - 560 mmWeight: 3400 kgDimension: W7224 x D1520 x H1440 mmProduct description: Heller 2043 MK7 SMT Reflow Oven, Heating Zones: Top 13 / Bottom 13, PCB Width: 50 - 560 mm,
Lead Free SMT Reflow Oven XMR-1000D Product features: ▶fully meet all kinds of lead-free welding process requirements. ▶WindowsXP operating system, English and Chinese interface, easy to learn operation; Standard air furnace, patented hot air system
THE SEAL 3M BRAND 2130 FLAME RETARDANT, TWO-PART, POLYURETHANE RESIN. WITH STANDS EXTREME TEMPERATURE CONDITIONS. MAY BE SEALED AT 0�C. THE MOST COMPLETE AND VOID FREE SEAL ON THE MARKET. THE SYSTEM DUO PACK CARTRIDGE TO ASSURE CORRECT PROPORTI
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
New Equipment | Solder Materials
12 hrs Lead Free Solder Paste with excellent Wettability Low Void
World's First Super Fast Low Temperature Underfill. SMT88U is an adhesive, which combines the advantages of fast cure in UV adhesives, and the better reliability of capillary underfill. It can be underfilled at room temperature without preheating a
SMT 158UL is a super-fast flow capillary underfill, which can flow into 10μm gap at room temperature without preheating a substrate. After cure there is void free in underfill. The cured SMT 158UL can be easily reworked. SMT 158UL not only can be use
SMT 88UL is a super-fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure, there is void free in underfill. The cured SMT 88UL can be easily reworked. SMT 88UL not only can be used a
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