New Equipment | Rework & Repair Services
BEST's QFN Rework Services Can Save Your Design and Save You Money BEST Inc. provides a variety of QFN rework services including the most popular QFN package styles. BEST has lots of experience in minimizing the voiding in QFN rework. BEST can mini
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Solder Materials
For high density and advanced package technology, We provide new Solder Paste for PoP applications. Package on Package Solder Paste has better wettability, solderability and low void than others.
New Equipment | Solder Materials
AIM introduces M8 Solder Paste, a high reliability no clean paste for use with SAC305, REL22, REL61, and Sn/Pb alloys. M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly success
The MX-3600 is an In-line X-RAY inspection system with the new MIPS-inspection platform of MatriX Transmission X-RAY technology is combined with the patented Slice-Filter Technology (SFT) for double-sided or overlaying applications. The high speed MX
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
Automatic high-speed in-line inspection system for electronic devices and assemblies. Featuring transmission x-ray technology, intelligent handling system for fast loading/unloading as well as MIPS software solutions for inspection of single-sided an
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
BGA & QFN Inspection Made Easy! The new BGA Inspector is a standalone software tool capable of analyzing images from different radiography systems. The BGA Inspector is unique in its ability to quickly and easily producing the results you need to v
Inline x-ray inspection system for combined 3D and transmission x-ray analysis of double-sided boards with high package density. Universal standard system based on the MatriX X2.5 AXI system motion concept with 360º angle shot coverage. A new 3D reco
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
