New SMT Equipment: void profile (Page 1 of 1)

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

SACM™ Soldering Alloy

SACM™ Soldering Alloy

New Equipment | Solder Materials

Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to

Indium Corporation

MULTICORE Solder Pastes

MULTICORE Solder Pastes

New Equipment | Solder Materials

As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr

Henkel Electronic Materials

Indium8.9 Pb-Free Solder Paste

Indium8.9 Pb-Free Solder Paste

New Equipment | Solder Materials

Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t

Indium Corporation

SN100C-XF3+ Lead-free Solder Paste

SN100C-XF3+ Lead-free Solder Paste

New Equipment | Solder Materials

Cobar XF3 Solder Paste Completes SN100C Solder Materials System; Superior Reflow, Printing Performance over SAC Alloys. XF3 is a lead-free solder paste, developed to accommodate extended reflow profiles without use of nitrogen. XF3 completes the

Cobar Solder Products Inc.

ePaste Lead-Free Solder Paste

ePaste Lead-Free Solder Paste

New Equipment | Solder Materials

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a

Nihon Superior Co., Ltd.

Henkel Surface Mount Adhesives

Henkel Surface Mount Adhesives

New Equipment | Materials

As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app

Henkel Electronic Materials

Bob Willis Electronics Assembly Video Library

Bob Willis Electronics Assembly Video Library

New Equipment | Education/Training

Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for

ASKbobwillis.com

4300/LF-4300 Water Washable No-Clean Solder Paste

4300/LF-4300 Water Washable No-Clean Solder Paste

New Equipment | Solder Materials

Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. Both the LF-4300 and the 4300 offer true multi-process capabilities,

AMTECH

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World's Best Reflow Oven Customizable for Unique Applications
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