New SMT Equipment: voiding and cures (Page 1 of 3)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Education/Training

This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac

BEST Inc.

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Reflow and Curing Ovens

Reflow and Curing Ovens

New Equipment |  

Near Equilibrium Hot Gas Heating makes the CUREFLOW series the only choice for SMT Convection reflow and curing applications. 3 models to choose from.

ETS, LLC

RDS Curing and Drying Systems

New Equipment | Curing Equipment

For curing and drying requirements, rehm�s RDS series is available with completely customized heating and cooling lengths. Our modular design concept allows us to outfit the RDS with any combination of heating (Convection and/or IR), cooling, and UV

Rehm Thermal Systems Korea Limited

Henkel Loctite Gaskets and Sealants

Henkel Loctite Gaskets and Sealants

New Equipment | Materials

25 Sealants LOCTITE 5210 One-component ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework applic

Henkel Electronic Materials

long wave infrared reflow and curing ovens

New Equipment |  

IC'S, Hybrids SMT Silver glass curing BGA reflow Gold/tin reflow Package sealing with N2H2

ROBOTHERM

UV Curable Glob Top and Dam-and-Fill Encapsulants

UV Curable Glob Top and Dam-and-Fill Encapsulants

New Equipment | Materials

For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline

Zymet, Inc

Current and Voltage Sensors epoxy potting machine

Current and Voltage Sensors epoxy potting machine

New Equipment | Dispensing

About 2 part silicone Metering, Mixing and Dispensing System The 2 part silicone Metering, Mixing and Dispensing System accurately meters, mixes and dispenses two-component materials like potting compounds, encapsulants, casting materials and adhesi

Guangzhou Daheng Automation Equipment Co.,LTD

epoxy resin meter mix and dispensing machine for Current and Voltage Sensors

epoxy resin meter mix and dispensing machine for Current and Voltage Sensors

New Equipment | Design Services

Epoxy resin meter mix and dispensing machine for Current and Voltage Sensors Product Description AB machine polyurethane a vendre auto pu machine from China Why Choose us ! Where to buy polyurethane machine ? We Daheng Automation specialize in d

Guangzhou Daheng Automation Equipment Co.,LTD

  1 2 3 Next

voiding and cures searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
Selective Soldering Nozzles

Software for SMT placement & AOI - Free Download.
Voidless Reflow Soldering

High Throughput Reflow Oven
SMT feeders

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...


Internet marketing services for manufacturing companies