New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Rework & Repair Services
In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur
ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for all IPC inspection standards. Visual Inspection Services ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for a
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New Equipment | Curing Equipment
IR Oven Curing Oven - Fast and Uniform Heating for Superior Results Product Description I.C.T IR oven is cost-effective Curing Oven produced by I.C.T, mainly to deal with the application of glue curing,special soldering,SMD testing, Anti-corrosi
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New Equipment | Curing Equipment
IR Oven Curing Oven - Fast and Uniform Heating for Superior Results Product Description I.C.T IR oven is cost-effective Curing Oven produced by I.C.T, mainly to deal with the application of glue curing,special soldering,SMD testing, Anti-corrosi
Nordson ASYMTEK’s advanced multiple camera imaging technology offers high-speed inspection with exceptional defect coverage. With dual sided viewing (top-down and bottom up) cameras and UV lighting the FX-942 ACI inspects conformal coating coverage a
New Equipment | Coating Equipment
The Select Coat Applicator Series – which includes the SC-350 Select Spray and the SC-300 Multi-Mode – is a highly-versatile conformal coating applicator that supports a wide range of fluid viscosities and is ideal for solvent or solvent-less fluid f
New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Near Equilibrium Hot Gas Heating makes the CUREFLOW series the only choice for SMT Convection reflow and curing applications. 3 models to choose from.
