New SMT Equipment: voiding bga (Page 2 of 4)

Alpha Solder Paste

Alpha Solder Paste

New Equipment | Solder Materials

Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f

Stellar Technical Products

MX-3600 Entry-level high-speed AXI System

MX-3600 Entry-level high-speed AXI System

New Equipment | Inspection

The MX-3600 is an In-line X-RAY inspection system with the new MIPS-inspection platform of MatriX Transmission X-RAY technology is combined with the patented Slice-Filter Technology (SFT) for double-sided or overlaying applications. The high speed MX

MatriX Technologies GmbH

Image Processors For Real-Time X-ray Inspection Systems

Image Processors For Real-Time X-ray Inspection Systems

New Equipment | Inspection

GTI-5000 BGA "Surface Mount" PCB Analysis The GTI-5000 Computer Image Processor is designed for the x-ray analysis of surface mount, BGA and PCB components. The software can provide analysis of BGA defects including bridging, voids and missing ball

Glenbrook Technologies

X-eye 6200 - In-Line 2D AXI / WAXI

X-eye 6200 - In-Line 2D AXI / WAXI

New Equipment | Inspection

In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r

SEC

VERTEX II Next Generation Affordable X-ray Inspection

VERTEX II Next Generation Affordable X-ray Inspection

New Equipment | Inspection

VJ Electronix leads the way in providing robust and practical X-ray solutions to solve real production issues. Innovation and simplicity govern system design to maximize ease-of-use with programmed inspection and a simple 1–2–Go! user int

VJ Electronix

Underfill FF35

Underfill FF35

New Equipment | Materials

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf

AIM Solder

X3 3D X-Ray - Automated In-line X-Ray Inspection System

X3 3D X-Ray - Automated In-line X-Ray Inspection System

New Equipment | Inspection

Automated 2D & 3D inspection Unsurpassed image quality High defect detection Low false calls Fast throughput Quick set-up Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of sol

Nordson YESTECH

X2 2D X-Ray - Automated In-line X-Ray Inspection System

X2 2D X-Ray - Automated In-line X-Ray Inspection System

New Equipment | Inspection

Automated 2D inspection Unsurpassed image quality Highest defect detection, low false calls Fast throughput Quick set-up Cost effective Nordson YESTECH’s versatile X2 Automated 2D X-Ray Inspection System (AXI) offers complete i

Nordson YESTECH

Xi3400 Automated X-ray Inspection System

Xi3400 Automated X-ray Inspection System

New Equipment | Inspection

Automated 2D & 3D inspection, variable magnification, high defect detection, low false calls, fast throughput, quick set-up. The Xi3400 is the latest addition to Nordson’s comprehensive range of test and inspection equipment for electronic device ma

Nordson DAGE

X-Scope 6000 Cabinet X-Ray Inspection System

X-Scope 6000 Cabinet X-Ray Inspection System

New Equipment | Inspection

130kV, 5 Micron Microfocus X-Ray Inspection System The X-SCOPE 6000 is digitally full programmable CNC controlled x-ray inspection system that allows operators to program inspection and measurement routines with point and click ease. Standard featu

SCIENSCOPE International


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