The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p
Our fully automated silicon wafer dicing service consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems, we know that a good wafer dicing or wafer cutting process sets the pace for all rema
APD DEVELOPS creative solutions to challenging micro machining problems, using precision diamond dicing blades and lasers to cut and machine a variety of hard brittle materials.
New Equipment | Cleaning Agents
For Wafer Dicing / Laser sawing
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent
NGA provides complete Micro automation dicing saw models 1006 and 1100 support. We rebuild Saws by doing a complete overhaul of the machine replacing neccessary parts to make the machine function like new. We have available spare parts for sale. W
PROMEX INDUSTRIES now fills the need for on shore integrated circuit assembly and packaging foundry services for small lots and prototypes through medium volume production. We are committed to providing high quality, quick turnaround semiconductor
Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, good porosity, durable absorption, excellent quali
To compliment our wafer dicing and inspection processes, Syagrus Systems offers fully automated die sorting services. Whether you require high volume production or a single wafer prototype build, Syagrus Systems has the die sorting solution for you.
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