New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems. It is recommended for wave solder process and ros
Specialty Solder Products for SMT Assembly- Solder Paste (No-Clean, Water Wash), Solder Spheres, Fluxes, Preforms, Wire, Ribbon.
is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes and SMT adhesives from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems.
1.Modularized heating system. 2.Nitrogen protection system. 3.External high-power water-cooling system. 4.Flux Collecting system.
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
New Equipment | Wave Soldering
Maximizes Yields and Reduces Rework The ECD Fluxometer® maximizes yields and reduces rework by qualifying your spray fluxer pattern uniformity and top-side-penetration. Improve Process Quality - Eliminate guesswork when it comes to managing the c
The Evolution 6 is designed to deliver zero defect soldering at high conveyor speeds with all flux types including conventional solvent based, water based, water soluble and VOC free; giving contract assemblers the freedom to change process technolog
New Equipment | Solder Materials
KappFreeA the acid cored convenient one-step, Lead-free, Cadmium-free, Potable Water Solder produces strong and ductile joints on Copper and Brass without requiring additional liquid or paste flux. The internal acid flux is released on heating to rem
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302