New SMT Equipment: water soluable flux (Page 10 of 59)

WP616 Solder Paste

WP616 Solder Paste

New Equipment | Solder Materials

WP616 is a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP616 provides a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning,

Kester

IONOX® I3302 Broad Spectrum Electronics Cleaner

IONOX® I3302 Broad Spectrum Electronics Cleaner

New Equipment | Cleaning Agents

Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.

KYZEN Corporation

ALPHA® Cored Wire

ALPHA® Cored Wire

New Equipment | Solder Materials

Alpha has a range of flux cored solder wires for component attach, rework and touch-up soldering for through-hole and surface mount technologies.  The range includes no-clean, water-soluble and activated rosin fluxes in a variety of solder alloys.  A

MacDermid Alpha Electronics Solutions

W20 Water Soluble Solder Paste

W20 Water Soluble Solder Paste

New Equipment | Solder Materials

AIM’s W20 water soluble solder paste is a zero halide/halogen flux formula. W20 has been engineered for enhanced wetting performance on all solderable electronic surfaces. W20 exhibits excellent print characteristics and 8+ hours of stencil life. W20

AIM Solder

INDIUM CORP OF AMERICA

New Equipment |  

Specialty Solder Products for SMT Assembly- Solder Paste (No-Clean, Water Wash), Solder Spheres, Fluxes, Preforms, Wire, Ribbon.

West-Tech Materials

Decotron 348

New Equipment |  

is a water-based cleaning medium, designed to quickly remove fluxes, solder pastes and SMT adhesives from PC boards, stencils, screens and mis-prints in heated and unheated spray-in-air and ultrasonic cleaning systems.

DCT Cleaning

lead-free Reflow soldering ssystem

lead-free Reflow soldering ssystem

New Equipment |  

1.Modularized heating system. 2.Nitrogen protection system. 3.External high-power water-cooling system. 4.Flux Collecting system.

Hexi Electronic Equipment Co.,LTD

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

CYBERSOLV® C8508 - Spray Cleaner for Reflow Ovens

CYBERSOLV® C8508 - Spray Cleaner for Reflow Ovens

New Equipment | Cleaning Agents

CYBERSOLV® C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. CYBERSOLV® C8508 has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lea

KYZEN Corporation

IONOX® BC - Semi-Aqueous Solvent Electronics Cleaner

IONOX® BC - Semi-Aqueous Solvent Electronics Cleaner

New Equipment | Cleaning Agents

IONOX® BC is a general purpose semi-aqueous solvent blend specially designed for effective removal of flux residues and dried uncured adhesives. IONOX® BC is approved for manual stencil cleaning as well as underscreen wipe applications. Manufactur

KYZEN Corporation


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