New SMT Equipment: wave solder machine (Page 2 of 66)

StencilQuik™ BGA Rework Stencils

StencilQuik™ BGA Rework Stencils

New Equipment | Solder Paste Stencils

Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process?  Are you squeezed for space on the PCB in an

BEST Inc.

APR Solder Paste Dipping Plate

APR Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

SMT Framed Metal Stencils

SMT Framed Metal Stencils

New Equipment | Solder Paste Stencils

SMT Framed Stencils are laser cut solder paste stencils designed to work on SMT printing machines. These laser cut stencils are permanently glued into a frame. These framed stencils are are designed for highly repeatable continuous operation in volum

BEST Inc.

PCB Rework Services

PCB Rework Services

New Equipment | Rework & Repair Services

BEST offers contract PCB rework services. If you get in bind and need resources to perform difficult repairs or if the volume of work ahead of you is too extreme to get through in the deadline at hand then consider BEST PCB rework services. If you th

BEST Inc.

SRT Component Printing Metal Stencils

SRT Component Printing Metal Stencils

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printing

BEST Inc.

Solder Paste Dipping Plate

Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

BGA Reballing Services

BGA Reballing Services

New Equipment | Rework & Repair Services

BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine

BEST Inc.

HotDots™ for Holding Jumper Wires in Place

HotDots™ for Holding Jumper Wires in Place

New Equipment | Rework & Repair Equipment

BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a

BEST Inc.

APR Component Printing Metal Stencil

APR Component Printing Metal Stencil

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin

BEST Inc.

Component Printing Metal Stencil

Component Printing Metal Stencil

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin

BEST Inc.


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