For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
Where High Mix Meets High Speed. With the MY100e series pick-and-place machines, there’s no need to make the usual trade-offs between speed and flexibility. With the fastest changeovers in the industry and workcell solutions reaching speeds of up t
Discover the new Nokia 8800 phone. Created for your ultimate pleasure, its graceful looks and seamless functions will leave a lasting impression. Every aspect has been meticulously considered and precisely engineered; from the laser-cut curves of its
The ideal solution for any market. Genesis features a powerful combination of speed and flexibility to blur the boundaries between high-speed and flexible fine pitch placement. Outstanding price performance combines with traditional Universal uptime
Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
Automatic Pick and Place TP50V Product Description: TP series is a fully automatic vision SMT pick and place machine, it can mount a variety of components through the vacuum nozzle can be mounted .it is the most cost effective automatic placement e
TR360 is the simplest solution, the most compact-size and cost-efficient reflow oven, but it is functional over your expectation, fully like the large full-size reflow oven. Please see details below: 1). It is suitable for both leaded and lead-fr
| 1 |
