New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
For Wire Bonding (Wedge Bonding) with follow types; Fine Wire Wedge Heavy Wire Wedge Ribbon Wire Wedge
Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames.
Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual
Single splice tape w/edge alignment (K.0208.1, K.0212.1, K.0216.1, or K.0224.1) is used for splicing together the cover tape of either 2 reels of taped components, or 2 strips of taped components. Single splice tape is usually used in conjunction wit
Double splice tape (K.0108.3, K.0112.3, K.0116.3, or K.0124.3) is used for splicing together the top and bottom cover tape or cover tape and pocket bottoms of either 2 reels of taped components, or 2 strips of taped components. Double splice tape can
For Wire Bonding (Wedge and Ball Bonding)
For Wire Bonding (Heavy Wire Wedge Bonding)
The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
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