New SMT Equipment: weight pad area ratio (Page 1 of 1)

Custom Pin Fin BGA Heat Sinks

Custom Pin Fin BGA Heat Sinks

New Equipment | Other

BGA Heat Sink (High Aspect Ratio Ext.) High efficiency pin fin design provides low pressure drop characteristics Large surface area increases heat sink performance Fabricated from extruded aluminum, which minimizes thermal resistance fro

Advanced Thermal Solutions, Inc

PCB Manufacturing - USA

PCB Manufacturing - USA

New Equipment | Assembly Services

Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e

PNC Inc.

HD-PAD Handheld Digital Microscope

HD-PAD Handheld Digital Microscope

New Equipment | Inspection

The YSC HD-PAD is the perfect tool for quick and immediate inspection needs. This inspection magnifier provides crystal clear images for the user. Its compact and ergonomic design is comfortable to hold and highly intuitive to use. The display deli

YSC Technologies

PI Series Advanced 3D SPI

PI Series Advanced 3D SPI

New Equipment | Inspection

PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new ge

Vi TECHNOLOGY

3D Master 3000 neo / wide - Table Top SPI System

3D Master 3000 neo / wide - Table Top SPI System

New Equipment | Inspection

Description This device is designed to measure the shapes of 3-dimensional surfaces of objects that measure from dozen microns to a few millimeters, and is commonly used for measuring solder paste samples spread over PCBs automatically and 3-dimens

Synapse Imaging Co., Ltd.

Agilent Medalist SP50 Series 3 - SPI

Agilent Medalist SP50 Series 3 - SPI

New Equipment | Inspection

Automated 3D paste inspection for print process characterization, control and early defect prevention Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is th

Agilent Technologies, Inc.

Symbion P36 Plus - SPI  System

Symbion P36 Plus - SPI System

New Equipment | Inspection

Symbion P36 is an inline high-speed API solution that delivers 100% coverage for improving your product quality and boosting your productivity. Post-Paste AOI Instant Programming Easy Gerber Import 2D/3D Laser Path Superior POP™ D

Orpro Vision GmbH

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Component Placement 101 Training Course
SMT spare parts - Qinyi Electronics

Reflow Soldering 101 Training Course
Win Source Online Electronic parts

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
2024 Eptac IPC Certification Training Schedule

High Throughput Reflow Oven
Circuit Board, PCB Assembly & electronics manufacturing service provider

World's Best Reflow Oven Customizable for Unique Applications


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