The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
New Equipment | Test Equipment
MUST System III – Solderability test system (wetting balance) tests to IEC 60068-2-54 and 60068-2-69, MIL-STD-883 Method 2022, IPC/IEC J-STD003A, IPC/IEC/JEDEC J-STD-002B and EIA/JET-7401. Includes everything needed for all forms of solderability t
New Equipment | Solder Materials
FCT Assembly Fluxes are designed to be used with both SN100c and SAC305 alloys. By combining our latest flux tecnologies with SN100c, FCT Assembly has an advantage over all other suppliers in paste, wire and flux. FCT Assembly Flux Comparisons:
New Equipment | Solder Materials
eFlux Selection: Rosin Based Flux for Lead-Free Wave Soldering NS-F850. NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum through hole fill and facilitates the solder drainage that ensures minimum bridges an
New Equipment | Solder Materials
Lead-free wave and selective soldering systems require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new acti
Wet process applications, plating, chemical etch, rinsing, and cleaning.
Wet process applications, plating, chemical etch, rinsing, and cleaning.
Wet process applications, plating, chemical etch, rinsing, and cleaning.
Temperature control for etchers, wet benches, process control
L/L->R (programmable) Cleaning System: Wet/dry/vacuum Mark Point Recognition: Automatic
