New Equipment | Coating Equipment
Double sided tape application system, there are two working methods of the tape coater, one is the process of drying after coating, and the second is the method of coating the photosensitive emulsion on the screen after multiple wet pressing operatio
● Arch bridge type suspending direct-connected scraper, programmable printing head. ● Double sliders ensures the printing head moving accuracy and stability when scraper is running back and forth. ● Programmable motor controls conveying speed and
New Equipment | Solder Materials
WS159 water washable solder paste is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in PCB Assemblies. WS159 offers high levels of repeatability and consistency even in a wide range of
Pickering Series 200 Surface Mount Reed Relays Including coaxical types for up to 5GHz SoftCenter™ construction Highest quality instrumentation grade switches Encapsulated in plastic package with internal mu-metal screen for side-by-side
Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating mo
New Equipment | Solder Materials
AIM's NC273LT solder paste formula with bismuth containing alloys can provide an assembler with an innovative solution when temperature sensitivity is paramount. The revolutionary activator system in AIM's new NC273LT low temperature solder paste im
New Equipment | Solder Materials
WS715M is a neutral alcohol based, organically activated, rosin-free, water soluble liquid flux designed specifically for wave solder applications. Though designed for application via foam fluxer, WS715M may also be applied by automated flux sprayers
New Equipment | Solder Paste Stencils
Laser cut stainless steel Adhesive Stencil for adhesive printing. Adhesive stencils are used to solder SMD components with a solder wave, whereas the components are fixed with an adhesive. The adhesive spots are print in one printing process by usin
Wafer-level Product In-line(Ireland) 2D, 3D CT AXI Machine Automatic inspection equipment exclusively for the Wafer-level products and ultra-fine defects of mm can be detected using the Nano Tube of Class Focal spot 200nm. 2D, as well as 70&o
New Equipment | Solder Materials
AIM’s REL61™ is comprised of tin, bismuth, silver, copper and trace amounts of elemental grain structure refiners. REL61 has proven to reduce tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and drop shock resista
