New SMT Equipment: wind wafer inspection system (Page 1 of 1)

Wafer Level Chip Scale Marker : CSM 2000

New Equipment |  

User friendly operating software, Ultra stable diode-pumped Nd :YAG green laser, Support Wafer Size : 4,5,6 & 8" wafers, option : 8 to 12" wafers, Absolutely free from damage on the fabricated wafer, High accurate marking position alignment using th

EO Technics Co., Ltd.

MX2000IR - Wafer AOI

MX2000IR - Wafer AOI

New Equipment | Inspection

Highly Accurate Fully Automatic Wafer Inspection with Handling Unit For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive

Viscom AG

MX100IR - Desktop Wafer AOI

MX100IR - Desktop Wafer AOI

New Equipment | Inspection

Automatic, High Accuracy Desktop Wafer Inspection For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection of sur

Viscom AG

DEK Galaxy - Screen Printer

DEK Galaxy - Screen Printer

New Equipment | Printing

Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno

ASM Assembly Systems (DEK)

Machine Vision Systems

Machine Vision Systems

New Equipment | Inspection

Machine vision uses image capture and analysis to automate tasks such as inspection, gauging, and counting, in addition to reading barcodes and optical characters (OCR). While human inspectors can visually inspect parts to judge the quality of workma

Microscan

850G Die Placement AOI

850G Die Placement AOI

New Equipment | Inspection

Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu

Machine Vision Products, Inc

ScanCOMPONENT PC-based Offline Component Programming System

ScanCOMPONENT PC-based Offline Component Programming System

New Equipment | Software

The ScanCOMPONENT Product helps in creating vision files for your placement machines. It is its own standalone product or a module within the ScanINSPECT VPI product. ScanCOMPONENT is a PC-based offline component programming system for the creatio

ScanCAD International, Inc.

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

New Equipment | IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte

Finetech

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wind wafer inspection system searches for Companies, Equipment, Machines, Suppliers & Information

INSPECTION TECH
INSPECTION TECH

Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.

Equipment Dealer / Broker / Auctions

Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea

Phone: +82-1029254936

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
Blackfox IPC Training & Certification

Wave Soldering 101 Training Course
Win Source Online Electronic parts

Software for SMT placement & AOI - Free Download.
PCB Handling with CE

Training online, at your facility, or at one of our worldwide training centers"