3D X-ray Offline CT Inspection System For Semicon/Electronics Inspection--ML-MirXT-160 Equipment overview The 3D X-ray inspection system ML-MirXT-160 is specially tailored for wafer technology, SMT, packaging inspection, semiconductor and laborator
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
New Equipment | Assembly Services
BEST can provide you with analysis services for your BGAs using x-ray equipment. We rework thousands of BGAs and POPs every year, therefore, we have the expertise in BGA X-ray inspection. BEST can be your outsourced BGA x-ray inspection source for o
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon
For Wire Bonding with follow types; Au Wire Al Wire Cu Wire
For Wire Bonding (Ball Bonding)
For Wire Bonding (Heavy Wire Wedge Bonding)
Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr
For Wire Bonding (Wedge Bonding) with follow types; Fine Wire Wedge Heavy Wire Wedge Ribbon Wire Wedge
