New Equipment | Cleaning Equipment
World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel Construction Automatic Wash/Rinse/Test/Dry 230VAC, 10AMP, 50/60Hz
Surface Mount, Through Hole, or Mixed Technology on Single or Double Sided PWB assemblies BGA, CSP, components to 0402, Fine Pitch to 12 mils, 100% passive testing prior to placement. In-circuit programming, full functional testing and automated opt
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Our Wave Solder Fixtures increase productivity and eliminate defects in your pcb assembly process. This type of fixture supports the pcb on all four sides eliminating warpage that can cause solder skips and bridges or pcb flooding. They also elim
LED PCB X-Ray Inspection System X-1200 SMT /Semicon/Solar/Harness Connector/LED PCB (Special for LED 1200mm) High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 90KV 5μm closed X-ray tube,with long life,maintenance in free 1.
X-Ray inspection system X6600 SMT/Semicon/Solar/Connector/LED High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 90KV 5μm closed X-ray tube,with long life,maintenance in free 1.3 million high resolution digital flat panel det
X-Ray inspection system X7600 SMT/Semicon/Solar/Connector/LED High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 90KV 3μm (130 KV Optional)closed X-ray tube,long life time,maintenance in free 2.3 mllion high resolution digita
Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual
Welwyn Components� new SMT facility contains the latest manufacturing techniques for both standard and specialist chip resistors. These include high speed/ high precision printing and lasering equipment, grading and tape packing machines and a state
Welwyn Components� new SMT facility contains the latest manufacturing techniques for both standard and specialist chip resistors. These include high speed/ high precision printing and lasering equipment, grading and tape packing machines and a state
New Equipment | Cleaning Agents
MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its
