New SMT Equipment: wire bond solder (Page 2 of 18)

KappZapp7 Audiophile - the tin silver solder for speakers and audio equipment

KappZapp7 Audiophile - the tin silver solder for speakers and audio equipment

New Equipment | Solder Materials

The KappZapp7 - 7% Silver formula is an audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance. Low melting temper

Kapp Alloy & Wire, Inc

AlSi Bonding Pads

AlSi Bonding Pads

New Equipment | Materials

Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas

Heraeus Materials Singapore Pte Ltd

Kapp Copper-Bond Flux - High Temperature Soldering Flux

Kapp Copper-Bond Flux - High Temperature Soldering Flux

New Equipment | Solder Materials

Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien

Kapp Alloy & Wire, Inc

Aluminum Bonding

Aluminum Bonding

New Equipment | Materials

Alternative to Brazing S-Bond can be an alternative lower temperature joining process and replace brazing in some applications. S-Bond is very effective in soldering aluminum to aluminum as well as soldering aluminum to copper.

S-Bond Technologies

Soldering Assembly Services

Soldering Assembly Services

New Equipment | Assembly Services

S-Bond Technologies offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillar

S-Bond Technologies

SMT Assembly, Aluminum Bonding Wire

New Equipment |  

Tianjin Advanced Electronics Co., Ltd. is one Hi-Tech company. Special in semiconductor material and brazing. Provide fine bonding wire, including COB(chip on board) Al Si1% and pure gold wire. Advanced manufacturing technology and equipment .Whole

Advanced Electronics Co.,Ltd.

4000 Series Bond Testers

4000 Series Bond Testers

New Equipment | Test Equipment - Bond Testers

Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon

Nordson DAGE

KappRad - The Radiator Repair Solder

KappRad - The Radiator Repair Solder

New Equipment | Solder Materials

KappRad has been developed specifically to join and repair Aluminum and Aluminum Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier. Matching KAPP Golden Flux acts as a temperature guide to ensure simple app

Kapp Alloy & Wire, Inc

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

New Equipment | IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia

Hesse Mechatronics

X-eye 6200 - In-Line 2D AXI / WAXI

X-eye 6200 - In-Line 2D AXI / WAXI

New Equipment | Inspection

In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r

SEC


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