NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for
New Equipment | Solder Materials
Both bar and wire solder available in a variety of thicknesses for every soldering situation.
New Equipment | Assembly Services
S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join
New Equipment | Solder Materials
Kester wire products have been developed to provide superior performance for hand soldering in the electronics industry. While the globally available preferred products are listed below, other combinations and core fluxes may be available. The Kester
We offer a number of soldering machines for bonding Flex to PCB, Connector to PCB and micro cables to PCB/ connectors.
Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.
The CRX-Series of real time, high resolution x-ray inspection systems for PCBs and components including BGAs, bond wire and flip chip, providing yield improvement solutions for the printed circuit board assembly and advanced semiconductor-packaging i
The CRX-Series of real time, high resolution x-ray inspection systems for PCBs and components including BGAs, bond wire and flip chip, providing yield improvement solutions for the printed circuit board assembly and advanced semiconductor-packaging i
AIM Ultra Pure Bar Solder SN63/37 - 25 pack of 1lb bars AIM solders, AIM lead free bar solder, AIM no clean solder paste, AIM wire solder, AIM solder distributors Leading distributors of AIM solder products, including lead free bar solder, no-clean s
