New SMT Equipment: wires (Page 26 of 83)

XT-3 High-Resolution X-Ray Analyser

XT-3 High-Resolution X-Ray Analyser

New Equipment | Inspection

40mm Applications Solder Joint Quality (BGA, Leaded) Bridging Voiding Opens Bare boards (Inner layers, traces, vias) Component Package Inspection (wire bonds) Subtle Defect Inspection

MatriX Technologies GmbH

Transformer Terminal Blocks

Transformer Terminal Blocks

New Equipment | Components

Our designs feature easy and reliable wire connections. Snap-on feet allow quick attachment to flat mounting rails to snap-in devices. All products designed in accordance with IEC60998, UL1059, UL486E, CSA C22.2 No.158 standards.

DEGSON Electronics Co. Ltd.

Feed Through Terminal Blocks

Feed Through Terminal Blocks

New Equipment | Components

Connect easily and reliably with two conductors. Wire sizes range from 0.5mm2 to 35mm2. Available with and without fuse. All products designed in accordance with IEC60998, UL1059, UL486E, CSA C22.2 No.158 standards.

DEGSON Electronics Co. Ltd.

Barrier Terminal Blocks

Barrier Terminal Blocks

New Equipment | Components

Easy connections and wire sizes ranging from 0.5mm2 to 6mm2. Available with different pitches from 6.35 to 14mm, with or without cover. All products designed in accordance with IEC60998, UL1059, UL486E, CSA C22.2 No.158 standards.

DEGSON Electronics Co. Ltd.

Through-wall Terminal Blocks

Through-wall Terminal Blocks

New Equipment | Components

Easy connections and very high contact strengths. Wire sizes range from 0.5mm2 to 95mm2. All products designed in accordance with IEC60947, UL1059, UL486E, CSA C22.2 No.158 etc.

DEGSON Electronics Co. Ltd.

Microelectronics Packaging

Microelectronics Packaging

New Equipment | Assembly Services

The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to

STI Electronics

Soldering materials and fluxes

Soldering materials and fluxes

New Equipment | Solder Materials

Soldering materials: Soldering wires Soldering pastes Stencils Soldering shots Soldering balls Fluxes Rosin liquid and gel fluxes Fluxes residues do not cause corrosion http://www.selen.hr/pokaz_kategorie.php?cid=9

Selen d.o.o.

KS Terminals

KS Terminals

New Equipment | Cable & Wire Harness Equipment

KS Terminals founded in 1973, produces insulated and non-insulated copper terminals, insulated quick disconnectors, din terminals, cord end terminals, water proof heat shrinkable terminals with adhesive tubing, butt splice and other connectors, stain

South Electronics

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies


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