New Equipment | Tape and Reel Services
We specialize in 3M advanced technology carrier tapes for small packages such as WLCSP, discrete semiconductor, commercial and military passives and thin film timing devices. We have the industry's broadest selection of 3M carrier tape in stock and
New Equipment | Test Equipment
https://mechanical-devices.com/portfolio-posts/flextc-temperature-forcing-system/ High-Power Temperature Forcing System Ultimate cooling power 70W@-40⁰C/185W@0⁰C From -65⁰C to +175⁰C / 200⁰C A Hi-tech Breakthrough in Fluid Free Operation • Greates
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
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