New Equipment | Soldering Robots
Model: DH-800 Robot Automatic Dispenser product model： DH-800D Dispensing range： 300/300/90 maximum load Y/Z: 10KG/6KG Speed X& Y/Z(mm/sec) 500/500/300 external dimensions ： 465*495*697mm Body weight（KG): 42 capacity of decomposition ：0.01m
The ACP3648 connector pick & place work cell is a modular design that can be configured inline with ASG�s standard AEP-12T automatic electric press or standalone. It is based on a high-speed custom robot with X, Y, Z, Theta, and servo Gripper axes. T
New Equipment | Selective Soldering
The L-CAT NEO can be designed for either a stand alone or in-line soldering process. This next generation soldering robot will communicate with computer and smart devices for easy management. This is the next generation robot which has all the funct
New Equipment | Soldering Robots
Model number IDR-430 Table travel X axis 400 mm Y axis 300 mm Z axis 100 mm Speed PTP (X, Y, Z) 1 ~ 1000mm/sec CP (X, Y, Z) 1~ 100mm/sec Repeatability accuracy X, Y axis ��0.01mm Z axis ��0.01mm Potable weight Work 25Kg Tool 10Kg Teaching method Remo
New Equipment | Soldering Robots
H351 is 5 axis combined controller soldering robot for X,Y,Z,R,and solering wire feeding motion system. User-friendly robot teaching is achieved with a large LCD touch display.Using the block copy function,many other points can easily be entered aft
New Equipment | Soldering Robots
The global standard of selective soldering robots, desktop. Compact soldering robot, UNIX-410G series enable you to instantly automate soldering works. Choose this easy-to-install model from cellular to in-line manufacturing and more else. This esta
Optima™ II 7250 is a best choice of AOI, designed for SMT process measurement before reflow. High resolution Telecentric lens camera system, proofed it’s worked fine for the height of SMT. Multi optical resolution optioned, down to 01005 (Imperial) c
Highly Accurate Fully Automatic Wafer Inspection with Handling Unit For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive
1. The machine is designed for fast dispensing placement accuracy and repeatability without the expense for fast dispensing placement accuracy and repeatability ,even without the expense of coordinated X.Y moving ,it seamlessly integrates windows
Odd form is optimized for handling your toughest odd-form challenges, from large through hole connectors to components up to 50 mm tall. Don't settle for anything less than unbeatable accuracy and incredible speed That is what the D-9, Assembl�on's
