New Equipment | Fume Extraction
The BVX-201-KIT is a two operator, PRE-HEPA-GAS volume extraction system with two BVX-ARM-K1 designed to be used adjacent to the workbenches. Features and Benefits : Two station design for dynamic fume extraction New brushless motor, quiet opera
New Equipment | Solder Paste Stencils
MLT stainless steel and non-metal stencils (i.e. Kapton) are laser fabricated for applying solder paste, flux, solderballs, to circuit boards, wafers, and components for prototypes, volume production, and PCB rework.
CyberOptics 6604096 6604097 Laser Sensor in stock for sale, brand new original. Supply CyberOptics Laser sensor and SMT spare parts, JUKI MNLA Laser for 2010 2020 2030 2050 2060 FX-1 machine. JUKI 730 SENSOR E9631721000 E9630721000 JUKI 740 LA SENSO
MLT provides laser services to remove unwanted squeeze-out from exposed metal pads, traces, and cavities. Squeeze-out can take the form of polyimide adhesives or prepreg resins. Whether a part of your standard manufacturing process or needed for re
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst
The 3D Profiler is an automatic machine to measure the dent of the copper filled vias. The system offers the opportunity for 100% inspection to ensure the yield of the copper filling with inspection speeds of 5 minutes per panel and +/- 2 micron accu
Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil technologies on the market
New Equipment | Solder Paste Stencils
Stentech is at the forefront of the next generation of stencils, Electroformed Stencils, with more than ten years of research and development. Stentech has now been manufacturing quality Electroformed Stencils for over five years for our North Americ
New Equipment | Test Equipment
The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution o
Unprecedented combination of speed, accuracy and one-button simplicity for non-contact automated 3D scanning inspection. Dramatically Speeds Up Quality Assurance of Incoming Parts Inspection & In-Process Inspection of components on the manufacturing
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